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Ceramic PCB
3+N+3 Structure
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Blind/Buried Via
12+ Layers PCB
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High CTI PCB
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Thick-Copper PCB
Metal Core PCB
High Speed PCB
High Frequency PCB
High TG PCB
16 Layers FR4 IT180A+PI Immersion Gold 3u Rigid-Flex Multilayer PCB
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4/2/2/2/2/4 oz Thick-Copper 6 layers Power Source Device ENIG 2u Rigid PCB
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4 Layers 3/1/1/3 oz Thick-Copper Immersion Gold 2u 2.0mm Thickness Multilayer PCB
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2.6mm Thickness 3oz Thick-Copper Immersion Gold Customizable PCB
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TF Card AMC832-HF Double Side 0.2mm Thickness Hard Gold Body SUB PCB
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SYTech Sl10U Double-Side 0.25mm Thickness ENEPIG IC Substrate PCB Board
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MITSUBISHI GAS HL832NXA 4 Layers 0.2mm Thickness ENEPIG LGA SUB PCB
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HL832N 4 Layers 0.25mm Thickness Hoz Green ENEPIG EMMC Substrate PCB
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EM-526 6 Layers 0.5mm Thickness Hoz ENEPIG Advanced BGA Substrate PCB
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Double-Side 0.2mm Thickness MITSUBISHI GAS HL832NXA ENEPIG SUB PCB
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Advanced IC Substrate BT Material ENIG 2u Strict SM Flatness Control ≤5μm PCB
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6 Layers SYTech Sl643HU 0.5mm Thickness ENEPIG Hoz BGA Substrate PCB
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