Multilayer PCB Fabrication & PCB Assembly Manufacturer
Up to 64 Layers;
FR4 TG135/TG150/TG170;
Halogen Free/CTI≥600;
Aspect Ratio (Finish Hole) 28:1;
Sample Expedited 8 Hours(1-2Layer);
HDI PCB
Blind/Buried/Hybrid Via;
5+N(N+M)+5 Structure;
Trace Width/Spacing 1.6/1.6mil;
Laser Hole Size(mm)≥0.075;
High Density Interconnector;
High Frequency PCB
More than 85+ Types;
Rogers/Arlon/Taconic/Isola/
Nelco/F4B Serices,etc;
Materials can be Specified;
Impedance Tolerance ±5%(min);
High Speed PCB
Panasonic Megtron4/6/7;
TU-872SLK/Isola-FR408HR,etc;
Impedance Tolerance ±5%(min);
Dimension Accuracy ±0.02mm(min);
Line Width/Space Accuracy ±5%;
Metal Core PCB
Thermal Conductivity 1-398W/m.K;
Aluminum/Copper AC 500-4000V;
Post-bonding/Pre-bonding;
Sweat-Soldering/Conduct Adhesive;
Press-Fit/Embedded Coin(I, T U);
Rigid-Flex PCB
2-24 Layers;
Book/Air-gap/Fly-tail;
Unsymmetrical/Semi-Flex;
Width of Flexible Zone 3mm(min);
Dimension Accuracy ±0.05mm(min);
Substrate PCB
CSP/FC-CSP/SIP/FC-BGA/WB-CSP;
FR4/BT/High-Speed Material;
Trace Width/Space 12/12μm;
SM Registration:±20μm;
Strict SM Flatness Control ≤5μm;
Specialty PCB
Ceramic/Glass Material;
Hybrid Material Lamination;
Buried Capacitance/Resistance;
PTH/NPTH Step Slots;
Uneven/Segmented/Step Gold Finger;
Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities. PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM’s in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.
