EM-526 6 Layers 0.5mm Thickness Hoz ENEPIG Advanced BGA Substrate PCB

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Description:

  • Multilayer PCB Fabrication & PCB Assembly Manufacturer

Up to 64 Layers;

FR4 TG135/TG150/TG170;

Halogen Free/CTI≥600;

Aspect Ratio (Finish Hole) 28:1;

Sample Expedited 8 Hours(1-2Layer);

  • HDI PCB

Blind/Buried/Hybrid Via;

5+N(N+M)+5 Structure;

Trace Width/Spacing 1.6/1.6mil;

Laser Hole Size(mm)≥0.075;

High Density Interconnector;

  • High Frequency PCB

More than 85+ Types;

Rogers/Arlon/Taconic/Isola/

Nelco/F4B Serices,etc;

Materials can be Specified;

Impedance Tolerance ±5%(min);

  • High Speed PCB

Panasonic Megtron4/6/7;

TU-872SLK/Isola-FR408HR,etc;

Impedance Tolerance ±5%(min);

Dimension Accuracy ±0.02mm(min);

Line Width/Space Accuracy ±5%;

  • Metal Core PCB

Thermal Conductivity 1-398W/m.K;

Aluminum/Copper AC 500-4000V;

Post-bonding/Pre-bonding;

Sweat-Soldering/Conduct Adhesive;

Press-Fit/Embedded Coin(I, T U);

  • Rigid-Flex PCB

2-24 Layers;

Book/Air-gap/Fly-tail;

Unsymmetrical/Semi-Flex;

Width of Flexible Zone 3mm(min);

Dimension Accuracy ±0.05mm(min);

  • Substrate PCB

CSP/FC-CSP/SIP/FC-BGA/WB-CSP;

FR4/BT/High-Speed Material;

Trace Width/Space 12/12μm;

SM Registration:±20μm;

Strict SM Flatness Control ≤5μm;

  • Specialty PCB

Ceramic/Glass Material;

Hybrid Material Lamination;

Buried Capacitance/Resistance;

PTH/NPTH Step Slots;

Uneven/Segmented/Step Gold Finger;

Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities. PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM’s in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.